PD ES 59008-3:1999
Superseded
View Superseded by
Data requirements for semiconductor die Mechanical, material and connectivity requirements
Hardcopy , PDF
English
12-15-1999
03-07-2006
Specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally-packaged semiconductor die. Also gives recommendations for general industry good practice in its use.
| Committee |
EPL/47
|
| DocumentType |
Standard
|
| Pages |
14
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| ES 59008-3 : 1999 | Identical |
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