PD IEC/TR 60068-3-12:2007
Superseded
View Superseded by
Environmental testing Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile
Hardcopy , PDF
English
04-30-2007
10-17-2014
| Committee |
EPL/501
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy |
Presents two approaches to establish a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. The presented process window covers a great variety of electronic products, including a large range of package sizes (molded active electronic components, passive components and electromechanical components)
| Standards | Relationship |
| IEC TR 60068-3-12:2007 | Identical |
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