PN EN 60749-21 : 2011
Current
Current
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY
Published date
01-12-2013
Publisher
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Provides a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment.
| Committee |
TC 60
|
| DocumentType |
Standard
|
| PublisherName |
Polish Committee for Standardization
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60749-21:2011 | Identical |
| EN 60749-21:2011 | Identical |
Summarise
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