PN EN 61190-1-3 : 2008 AMD 1 2010
Current
Current
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
Published date
01-12-2013
Publisher
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| Committee |
TC 293
|
| DocumentType |
Standard
|
| PublisherName |
Polish Committee for Standardization
|
| Status |
Current
|
| Standards | Relationship |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Identical |
Summarise
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