PN EN 62374-1 : 2011 AC 2011
Current
Current
SEMICONDUCTOR DEVICES - PART 1: TIME-DEPENDENT DIELECTRIC BREAKDOWN (TDDB) TEST FOR INTER-METAL LAYERS
Published date
01-12-2013
Publisher
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Specifies a test method, test structure and lifetime estimation method of Time Dependent Dielectric Breakdown (TDDB) for Inter-metal layers applied in semiconductor devices.
| Committee |
TC 60
|
| DevelopmentNote |
Supersedes PN EN 62374. (01/2012)
|
| DocumentType |
Standard
|
| PublisherName |
Polish Committee for Standardization
|
| Status |
Current
|
| Supersedes |
Summarise
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