SAE AMS3684B
Superseded
View Superseded by
RESIN, POLYIMIDE, SEALING High-Temperature Resistant, 315 °C (600 °F) Unfilled
Hardcopy , PDF
English
01-01-1993
10-23-2016
This specification covers a single-component, unfilled, heat-reactive, thermosetting, aromatic system which thermally cures to form a polyimide polymer structure.
| DocumentType |
Standard
|
| Pages |
8
|
| PublisherName |
SAE International
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
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