SAE AMS3731/10C
Current
POTTING COMPOUND, EPOXY Bisphenol A-Type Unfilled, Room Temperature Cure, Semiflexible
Hardcopy , PDF
English
11-29-2017
1. SCOPE
2. APPLICABLE DOCUMENTS
3. TECHNICAL REQUIREMENTS
4. QUALITY ASSURANCE PROVISIONS
5. PREPARATION FOR DELIVERY
6. ACKNOWLEDGMENT
7. REJECTIONS
8. NOTES
Specifies an unfilled, room-temperature-polymerizing epoxy resin formulation with a polyamide hardener, supplied as a two-component system.
| DevelopmentNote |
Supersedes SAE AMS 3734 (08/2001)
|
| DocumentType |
Standard
|
| Pages |
4
|
| PublisherName |
SAE International
|
| Status |
Current
|
| Supersedes |
This specification covers an unfilled, room-temperature-polymerizing epoxy resin formulation with a polyamide hardener, supplied as a two-component system.
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