SEMI G42 : 1996(R2018)
Current
The latest, up-to-date edition.
SPECIFICATION FOR THERMAL TEST BOARD STANDARDIZATION FOR MEASURING JUNCTION-TO-AMBIENT THERMAL RESISTANCE OF SEMICONDUCTOR PACKAGES
01-12-2013
Provides requirements for a standard thermal resistance test board to be used in junction-to-ambient thermal resistance measurement of a semiconductor package under still- and forced-air condition as a referee method. Also describes the thermal resistance test board for measurement of the following packages: - plastic chip carrier package (PCC); - dual-in-line packages (DIP); - pin grid array package (PGA); - quad flat package (QFP); - and ball grid array package (BGA).
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.