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SEMI G68 : 1996(R2018)

SEMI G68 : 1996(R2018)

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TEST METHOD FOR JUNCTION-TO-CASE THERMAL RESISTANCE MEASUREMENTS IN AIR ENVIRONMENT FOR SEMICONDUCTOR PACKAGES

Published date

01-12-2013

Publisher

Semiconductor Equipment & Materials Institute

Determines thermal resistance of semiconductor packages using thermal test chips. Method deals with junction-to-case measurements of thermal resistance in an air environment. Results of this test method are used to obtain the junction temperature. Measurement results are usually different from the results obtained by testing in the fluid bath environment described in SEMI G30 and SEMI G43.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (05/2001)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current

SEMI G43 : 1987(R2011) TEST METHOD FOR JUNCTION-TO-CASE THERMAL RESISTANCE MEASUREMENTS OF MOLDED PLASTIC PACKAGES
SEMI G32 : 1994(R2011) GUIDELINE FOR UNENCAPSULATED THERMAL TEST CHIP
SEMI G30 : 1988(R2011) TEST METHOD FOR JUNCTION-TO-CASE THERMAL RESISTANCE MEASUREMENTS OF CERAMIC PACKAGES

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