SN EN 60749-18 : 2003

1 Scope<br>2 Terms and definitions<br>3 Test apparatus<br>&nbsp;&nbsp;3.1 Radiation source<br>&nbsp;&nbsp;3.2 Dosimetry system<br>&nbsp;&nbsp;3.3 Electrical test instruments<br>&nbsp;&nbsp;3.4 Test circuit board(s)<br>&nbsp;&nbsp;3.5 Cabling<br>&nbsp;&nbsp;3.6 Interconnect or switching system<br>&nbsp;&nbsp;3.7 Environmental chamber<br>4 Procedure<br>&nbsp;&nbsp;4.1 Sample selection and handling<br>&nbsp;&nbsp;4.2 Burn-in<br>&nbsp;&nbsp;4.3 Dosimetry measurements<br>&nbsp;&nbsp;4.4 Lead/aluminium (Pb/Al) container<br>&nbsp;&nbsp;4.5 Radiation level(s)<br>&nbsp;&nbsp;4.6 Radiation dose rate<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.6.1 Condition A<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.6.2 Condition B<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.6.3 Condition C<br>&nbsp;&nbsp;4.7 Temperature requirements<br>&nbsp;&nbsp;4.8 Electrical performance measurements<br>&nbsp;&nbsp;4.9 Test conditions<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.9.1 In-flux testing<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.9.2 Remote testing<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.9.3 Bias and loading conditions<br>&nbsp;&nbsp;4.10 Post-irradiation procedure<br>&nbsp;&nbsp;4.11 Extended room temperature anneal test<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.11.1 Need to perform an extended room <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;temperature anneal test<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.11.2 Extended room temperature anneal test <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;procedure <br>&nbsp;&nbsp;4.12 MOS accelerated annealing test<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.12.1 Need to perform accelerated annealing <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;test<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.12.2 Accelerated annealing test procedure<br>&nbsp;&nbsp;4.13 Test report<br>5 Summary