UNE-EN 60191-6-3:2000
Current
Current
Mechanical standardization of semiconductor devices -- Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) (Endorsed by AENOR in December of 2001.)
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
12-01-2001
Publisher
US$84.20
Excluding Tax where applicable
| Committee |
CTN 209/SC 47
|
| DocumentType |
Standard
|
| Pages |
21
|
| PublisherName |
Asociación Española de Normalización
|
| Status |
Current
|
| Standards | Relationship |
| EN 60191-6-3:2000 | Identical |
| IEC 60191-6-3:2000 | Identical |
| BS 759-1:1984 | Identical |
Summarise
US$84.20
Excluding Tax where applicable
Please Login or Create an Account so you can add users to your Multi user PDF Later.
Important note : All end users must be registered with an Account prior to user licenses being assigned.
Users cannot be edited or removed once added to your Multi user PDF.