UNE-EN IEC 61188-6-1:2021
Current
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (Endorsed by Asociación Española de Normalización in May of 2021.)
Hardcopy , PDF
English
05-01-2021
This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1 to IEC 61191-4.
| Committee |
CTN 203/SC 91-119
|
| DocumentType |
Standard
|
| Pages |
39
|
| PublisherName |
Asociación Española de Normalización
|
| Status |
Current
|
| Standards | Relationship |
| IEC 61188-6-1:2021 | Identical |
| EN IEC 61188-6-1:2021 | Identical |
| BS EN IEC 61188-6-1:2021 | Equivalent |
| I.S. EN IEC 61188-6-1:2021 | Equivalent |
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