UNE-EN IEC 61188-6-3:2025
Current
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (Endorsed by Asociación Española de Normalización in March of 2025.)
Hardcopy , PDF
English
03-01-2025
This International Standard specifies the requirements for lands and land pattern on circuit boards for the mounting of components with leads by soldering based on the solder joint requirements of the IEC 61191-1, and IEC 61191-3.
| Committee |
CTN 203/SC 91-119
|
| DocumentType |
Standard
|
| Pages |
40
|
| PublisherName |
Asociación Española de Normalización
|
| Status |
Current
|
| Standards | Relationship |
| I.S. EN IEC 61188-6-3:2025 | Equivalent |
| BS EN IEC 61188-6-3:2025 | Equivalent |
| EN IEC 61188-6-3:2025 | Identical |
| IEC 61188-6-3:2024 | Identical |
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