IPC 6801 : 0
Withdrawn
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IPC/JPCA TERMS & DEFINITIONS, TEST METHODS, AND DESIGN EXAMPLES FOR BUILD-UP/HIGH DENSITY INTERCONNECT (HDI) PRINTED WIRING BOARDS
09-12-2023
1 SCOPE
2 APPLICABLE DOCUMENTS
3 DEFINITIONS OF STRUCTURES AND TERMS
3.1 Structures
3.2 Terms and Definitions
3.3 Design
3.4 Manufacturing
3.5 Testing and Inspection
4 TEST METHODS FOR BUILD-UP/HDI MATERIALS
4.1 Coefficient of Thermal Expansion - Thermomechanical
Analyzer
4.2 Mechanical Properties
4.3 Water Absorption Property
4.4 Drying Property
4.5 Ionic Impurity
4.6 Flexibility
4.7 Dielectric Constant
5 TEST METHOD FOR BUILD-UP PRINTED BOARDS
5.1 Coefficient of Thermal Expansion (CTE)
5.2 Water Absorption Property
5.3 Drying Property
5.4 Ionic Impurity
5.5 Characteristic Impedance
5.6 Flatness
6 TEST METHOD FOR G BUILD-UP PRINTED BOARD
6.1 Peel Strength of Conductor Layer
6.2 Pull-Off Strength of Pads
6.3 Thermal Resistance Test for Packaging Build-Up
Printed Boards
7 RELIABILITY TEST METHODS
7.1 Thermal Shock Test (in Air)
7.2 Bias Test at High Temperature and High Humidity
7.3 High Temperature Shelf Test
8 DESIGN EXAMPLE
9 DESCRIPTION (CONTINUED DISCUSSION ITEMS/BACKGROUND OF
DEVELOPING JPCA STANDARD FOR BUILD-UP PRINTED BOARDS
9.1 Test Pattern
9.2 Description of Accelerated Test
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