BS EN 61190-1-3 : 2007
Current
The latest, up-to-date edition.
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
Hardcopy , PDF
English
01-01-2007
1 Scope
2 Normative references
3 Terms and definitions
4 Classification
5 Requirements
6 Quality assurance provisions
7 Preparation for delivery - Preservation, packing
and packaging
Annex A (informative) - Selection of various alloys and
fluxes for use in electronic soldering - General
information concerning IEC 61190-1-3
Annex B (normative) - Lead-free solder alloys tests
Annex C (informative) - Marking method of solder
designation for mounted board, used in electronic
equipment
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Describes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, power solders and solder paste, for electronic soldering applications and for 'special' electronic grade solders.
| Committee |
EPL/501
|
| DevelopmentNote |
Supersedes 98/231750 DC (09/2002) Supersedes 05/30133287 DC. (08/2007) 2007 Edition Re-Issued in March 2011 & incorporates AMD 1 2010. Supersedes 09/30190431 DC. (03/2011)
|
| DocumentType |
Standard
|
| Pages |
40
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN 61190-1-3:2007 | Identical |
| I.S. EN 61190-1-3:2007 | Identical |
| NF EN 61190-1-3 : 2008 AMD 1 2010 | Identical |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Identical |
| DIN EN 61190-1-3:2015-05 (Draft) | Identical |
| UNE-EN 61190-1-3:2007 | Equivalent |
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