CEI CLC/TS 50466 : 2006
Current
The latest, up-to-date edition.
LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - SPECIFICATION FOR IMPLEMENTATION
Hardcopy , PDF
English
01-01-2006
1 General
2 Normative references
3 Storage decision criteria
4 Purchasing procurement
5 Technical validation of the components
6 Conditioning and storage
7 Periodic check of the components
8 De-stocking
9 Feedfback
Annex A - Example related to components
Annex B - Examples of periodic and/or destocking tests
Annex C - Parameters influencing the final price of the
component storage
Annex D - Parameters influencing the quantity of the
components to be stored
Annex E - Failure mechanisms - Hermetically encapsulated
and non-encapsulated active components
Annex F - Failure mechanisms: GaAs components
Bibliography
Specifies implementation of long duration storage of electronic components.
| Committee |
CT 309
|
| DocumentType |
Standard
|
| Pages |
34
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| CLC/TS 50466:2006 | Identical |
| HD 323.2.20 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC PAS 62435:2005 | Electronic components - Long-duration storage of electronic components - Guidance for implementation |
| IEC TS 61340-5-2:1999 | Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide |
| IEC TR 62380:2004 | Reliability data handbook - Universal model for reliability prediction of electronics components, PCBs and equipment |
| IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
| IEC TS 61945:2000 | Interated circuits - Manufacturing line approval - Methodology for technology and failure analysis |
| EN 60068-2-17:1994 | Environmental testing - Part 2: Tests - Test Q: Sealing |
| IEC 60068-2-17:1994 | Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing |
| IEC TR 62258-3:2010 | Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage |
| EN 190000:1995 | Generic Specification: Monolithic integrated circuits |
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