CEI EN 60191-6-3 : 2001
Current
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-3: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF QUAD FLAT PACKS (QFP)
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-01-2001
Publisher
Foreword
1 Scope
2 Normative references
3 Definitions
4 Measuring methods
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
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