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CEI EN 62878-1-1 : 2016

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2016

Superseded date

13-06-2020

$272.48
Including GST where applicable

FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Test methods
5 Shipping inspection
Annex A (informative) - Related test methods
Bibliography
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Defines the test methods of passive and active device embedded substrates.

Committee
CT 309
DevelopmentNote
Classificazione CEI 91-80. (03/2016)
DocumentType
Standard
Pages
62
PublisherName
Comitato Elettrotecnico Italiano
Status
Superseded
SupersededBy

Standards Relationship
EN 62878-1-1:2015 Identical

IEC TS 62878-2-4:2015 Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
EN 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
EN 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
EN 60194:2006 Printed board design, manufacture and assembly - Terms and definitions

$272.48
Including GST where applicable