DIN EN 60191-6-3:2001-06
Current
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-3: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES; MEASURING METHODS FOR PACKAGE DIMENSIONS OF QUAT FLAT PACKS (QFP)
Available format(s)
Hardcopy , PDF
Language(s)
German
Published date
01-01-2001
$127.64
Including GST where applicable
Defines a method for quad flat packs (QFP) measuring dimensions classified into Form E.
| DevelopmentNote |
Supersedes DIN IEC 47D-221-CDV (07/2001)
|
| DocumentType |
Standard
|
| Pages |
16
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Current
|
| Standards | Relationship |
| I.S. EN 60191-6-3:2001 | Identical |
| NF EN 60191-6-3 : 2001 | Identical |
| IEC 60191-6-3:2000 | Identical |
| BS EN 60191-6-3:2001 | Identical |
| EN 60191-6-3:2000 | Identical |
Summarise
$127.64
Including GST where applicable
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