DIN EN 60749-14:2004-07
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY)
Hardcopy , PDF
German
01-01-2004
FOREWORD
1 Scope
2 Normative references
3 General
4 Test condition A - Tension
5 Test condition B - Bending stress
6 Test condition C - Lead fatigue
7 Test condition D - Lead torque
8 Test condition E - Stud torque
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.
| DevelopmentNote |
Supersedes DIN EN 60749. (06/2005)
|
| DocumentType |
Standard
|
| Pages |
19
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NF EN 60749-14 : 2004 | Identical |
| IEC 60749-14:2003 | Identical |
| BS EN 60749-14:2003 | Identical |
| NBN EN 60749-14 : 2004 | Identical |
| I.S. EN 60749-14:2003 | Identical |
| EN 60749-14:2003 | Identical |
| UNE-EN 60749-14:2004 | Identical |
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