DIN EN 60749-20-1:2009-10
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
Hardcopy , PDF
German
01-01-2009
Dieser Teil der DIN EN 60749 gilt für alle oberflächenmontierbaren Bauelemente (SMD) mit nicht hermetisch dichten Gehäusen, welche in einem Reflow-Lötverfahren beansprucht werden und die der Umgebungsatmosphäre ausgesetzt werden.
| DevelopmentNote |
Supersedes DIN IEC 60749-20-1. (10/2009)
|
| DocumentType |
Standard
|
| Pages |
39
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Current
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| IEC 60749-20-1:2009 | Identical |
| EN 60749-20-1:2009 | Identical |
| I.S. EN 60749-20-1:2009 | Equivalent |
| BS EN 60749-20-1:2009 | Equivalent |
| UNE-EN 60749-20-1:2009 | Equivalent |
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