I.S. EN 60749-20-1:2009
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
Hardcopy , PDF
English
01-01-2009
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Pertains to all non-hermetic SMD packages which are subjected to reflow solder processes and which are exposed to the ambient air.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
74
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| EN 60749-20-1:2009 | Identical |
| IEC 60749-20-1:2009 | Identical |
| DIN EN 60749-20-1:2009-10 | Equivalent |
| BS EN 60749-20-1:2009 | Equivalent |
| UNE-EN 60749-20-1:2009 | Equivalent |
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