SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 29: LATCH-UP TEST

Published date

19-08-2011

Publisher

European Committee for Standards - Electrical

FOREWORD
1 Scope and object
2 Terms and definitions
3 Classification and levels
4 Apparatus and material
5 Procedure
6 Failure criteria
7 Summary
Annex A (informative) - Examples of special pins
        that are connected to passive components
Annex B (informative) - Calculation of operating
        ambient or operating case temperature for
        a given operating junction temperature

Specifies the I-test and the overvoltage latch-up testing of integrated circuits. It establishes a method for determining integrated circuit latch-up characteristics and to define latch-up failure criteria.

Committee	SR 47
DevelopmentNote	Supersedes UNE EN 60749-24. (05/2014)
DocumentType	Test Method
PublisherName	European Committee for Standards - Electrical
Status	Current
Supersedes	UNE-EN 60749-24:2005

Standards	Relationship
IEC 60749-29:2011	Identical
NBN EN 60749-29 : 2011	Identical
NEN EN IEC 60749-29 : 2011	Identical
I.S. EN 60749-29:2011	Identical
PN EN 60749-29 : 2011	Identical
UNE-EN 60749-29:2004	Identical
BS EN 60749-29:2011	Identical
CEI EN 60749-29 : 2012	Identical
DIN EN 60749-29:2012-01	Identical
NF EN 60749-29 : 2012	Identical
UNE-EN 60749-29:2011	Identical
BS EN 60601-2-44:2009+A2:2016	Identical

BS EN 60749-43:2017	Semiconductor devices - Mechanical and climatic test methods Guidelines for IC reliability qualification plans
I.S. EN 60749-43:2017	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS
EN 60749-43:2017	Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
CEI EN 60749-43 : 1ED 2018	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS