IEC 60191-3A:1976
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - First supplement
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French, Russian
01-01-1976
12-09-2022
Deals with design procedure for dimensions of integrated circuit packages, and rules for mounting integrated circuit packages into carriers.
| Committee |
TC 47/SC 47D
|
| DocumentType |
Standard
|
| Pages |
11
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| Standards | Relationship |
| BS 3934:Addendum No. 6:1989 | Similar to |
| NEN 10191-3 : 91 AMD 2 97 | Identical |
| BS 3934:1965 | Similar to |
| CEI 47-7 : 1ED 1981 | Identical |
| BS QC 763000(1990) : AMD 6754 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FILM AND HYBRID FILM INTEGRATED CIRCUITS. GENERIC SPECIFICATION |
| IEC 61747-1:1998+AMD1:2003 CSV | Liquid crystal and solid-state display devices - Part 1: Generic specification |
| IEC 60191-6-6:2001 | Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA) |
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