IEC 60749-3:2017
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French, English
03-03-2017
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
6 Failure criteria
7 Summary
Annex A (informative) - External visual report
form/checklist (example only - not a
mandatory template)
Bibliography
IEC 60749-3:2017 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.
This edition includes the following significant technical changes with respect to the previous edition:
a) reference to the need for ESD protection;
b) inclusion of information on the phenomenon of tin whiskers;
c) inclusion of an optional report form/checklist.
| Committee |
TC 47
|
| DevelopmentNote |
Supersedes IEC PAS 62163 (08/2002) Supersedes IEC 60749. (03/2008) Stability Date: 2022. (03/2017)
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-7318-0
|
| Pages |
21
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NEN EN IEC 60749-3 : 2017 | Identical |
| EN 60749-3:2017 | Identical |
| DIN EN 60749-3:2003-04 | Identical |
| PN EN 60749-3 : 2017 | Identical |
| BS EN 60749-3:2002 | Identical |
| CEI EN 60749-3 : 2004 | Identical |
| CEI EN 60749-3:2017-10 | Identical |
| I.S. EN 60749-3:2017 | Equivalent |
| UNE-EN 60749-3:2017 | Identical |
| NF EN 60749-3 : 2002 | Identical |
| BS EN 60749-3:2017 | Identical |
| UNE-EN 60749-3:2003 | Identical |
| SAC GB/T 4937-3 : 2012 | Identical |
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