BS EN 60749-3:2017
Current
The latest, up-to-date edition.
Semiconductor devices. Mechanical and climatic test methods External visual examination
Hardcopy , PDF
English
24-11-2017
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
6 Failure criteria
7 Summary
Annex A (informative) - External visual report form/checklist
(example only - not a mandatory template)
Bibliography
Annex ZA (normative) - Normative references to international
Publications with their corresponding
European publications
Describes the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document.
| Committee |
EPL/47
|
| DevelopmentNote |
Supersedes 00/203562 DC. (09/2002) Supersedes BS EN 60749. (09/2005) Supersedes 16/30344800 DC. (11/2017)
|
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
The purpose of this part of IEC60749 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.
| Standards | Relationship |
| I.S. EN 60749-3:2017 | Identical |
| DIN EN 60749-3:2003-04 | Identical |
| IEC 60749-3:2017 | Identical |
| NBN EN 60749-3 : 2003 | Identical |
| NF EN 60749-3 : 2002 | Identical |
| EN 60749-3:2017 | Identical |
| UNE-EN 60749-3:2017 | Equivalent |
| I.S. EN 60749-3:2017 | Equivalent |
| EN 60749-3:2017 | Equivalent |
| EN 61340-5-1:2016/AC:2017-05 | ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS (IEC 61340-5-1:2016/COR1:2017) |
| IEC 61340-5-1:2016 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
| IEC 62483:2013 | Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices |
| IEC 60749-9:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking |
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