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IEC 60749-32:2002+AMD1:2010 CSV

Current

Current

The latest, up-to-date edition.

Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English, English - French

Published date

29-11-2010

$85.36
Including GST where applicable
Summarise this standard

FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Test Procedure

IEC 60749-32:2002+A1:2010 is applicable to semiconductor devices (discrete devices and integrated circuits). The object of this test is to determine whether the device ignites due to external heating. The test uses a needle flame, simulating the effect of small flames which may result from fault conditions within equipment containing the device. This consolidated version consists of the first edition (2002) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication.

Committee
TC 47
DevelopmentNote
Supersedes IEC 60749. (03/2008) Stability Date: 2015. (10/2012)
DocumentType
Standard
Pages
14
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

$85.36
Including GST where applicable