IEC 61189-5-503:2017
Current
The latest, up-to-date edition.
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French, English
22-05-2017
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Testing condition
5 Specimen
6 Equipment/Apparatus or material
7 Resistance measurement method
8 Test method
9 Procedure
Annex A (informative) - Forms of electrochemical migration
Bibliography
IEC 61189-5-503:2017 specifies the conductive anodic filament (hereafter referred to as CAF) and specifies not only the steady-state temperature and humidity test, but also a temperature-humidity cyclic test and an unsaturated pressurized vapour test (HAST).
| Committee |
TC 91
|
| DevelopmentNote |
Stability Date: 2022. (05/2017)
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-7362-3
|
| Pages |
47
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| DIN EN 61189-5-503:2016-02 (Draft) | Identical |
| NEN EN IEC 61189-5-503 : 2017 | Identical |
| PN EN 61189-5-503 : 2017 | Identical |
| EN 61189-5-503:2017 | Identical |
| BS EN IEC 61189-5-503:2017 | Equivalent |
| UNE-EN 61189-5-503:2017 | Identical |
| BS EN IEC 61189-5-503:2017 | Identical |
| CEI EN 61189-5-503 : 1ED 2017 | Identical |
| EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| BS EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
| IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IEC 60721-1:1990+AMD1:1992+AMD2:1995 CSV | Classification of environmental conditions - Part 1: Environmental parameters and their severities |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC TR 62866:2014 | Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing |
| ASTM D 257 : 2014 | Standard Test Methods for DC Resistance or Conductance of Insulating Materials |
| IEC 60068-2-66:1994 | Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IEC 60068-2-67:1995 | Environmental testing - Part 2-67: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components |
| IEC 60068-2-38:2009 | Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test |
| IEC 60721-2-1:2013 | Classification of environmental conditions - Part 2-1: Environmental conditions appearing in nature - Temperature and humidity |
| IPC 9691 : A | USER GUIDE FOR THE IPC-TM-650, METHOD 2.6.25, CONDUCTIVE ANODIC FILAMENT (CAF) RESISTANCE AND OTHER INTERNAL ELECTROCHEMICAL MIGRATION TESTING |
| IEC 60068-3-5:2001 | Environmental testing - Part 3-5: Supporting documentation and guidance - Confirmation of the performance of temperature chambers |
| IEC 60721-3-0:1984+AMD1:1987 CSV | Classification of environmental conditions - Part 3: Classification of groups of environmental parameters and their severities - Introduction |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 60068-3-4:2001 | Environmental testing - Part 3-4: Supporting documentation and guidance - Damp heat tests |
| IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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