IEC 61191-6:2010
Current
The latest, up-to-date edition.
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
14-01-2010
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Voids in solder joints
5 Measurement
6 Void occupancy
7 Evaluation
Annex A (informative) - Experimental results and simulation
of voids and decrease of life due to
thermal stress
Annex B (informative) - X-ray transmission equipment
Annex C (informative) - Voids in BGA solder ball
Annex D (informative) - Measurement using X-ray transmission
imaging
Bibliography
IEC 61191-6:2010 specifies the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation. This part of IEC 61191 is applicable to the voids generated in the solder joints of BGA and LGA soldered on a board. This part of IEC 61191 is not applicable to the BGA package itself before it is assembled on a board. This standard is applicable also to devices having joints made by melt and re-solidification, such as flip chip devices and multi-chip modules, in addition to BGA and LGA. This standard is not applicable to joints with under-fill between a device and a board, or to solder joints within a device package. This standard is applicable to macrovoids of the sizes of from 10 µm to several hundred micrometres generated in a soldered joint, but is not applicable to smaller voids (typically, planar microvoids) with a size of smaller than 10 µm in diameter. This standard is intended for evaluation purposes and is applicable to research studies, off-line production process control and reliability assessment of assembly.
| Committee |
TC 91
|
| DevelopmentNote |
Stability Date: 2017. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
76
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 61191-6 : 2010 | Identical |
| NEN EN IEC 61191-6 : 2010 | Identical |
| I.S. EN 61191-6:2010 | Identical |
| PN EN 61191-6 : 2010 | Identical |
| BS EN 61191-6:2010 | Identical |
| CEI EN 61191-6 : 2011 | Identical |
| EN 61191-6:2010 | Identical |
| DIN EN 61191-6:2011-01 | Identical |
| JIS C 61191-6:2011 | Identical |
| UNE-EN 61191-6:2010 | Identical |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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