IEC 63055:2023
Current
The latest, up-to-date edition.
Format for LSI-Package-Board Interoperable design
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
English
11-10-2023
IEC 63055:2023 defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This is an IEC/IEEE dual logo standard.
| Committee |
TC 91
|
| DocumentType |
Standard
|
| Pages |
292
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
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