IEC 63055:2016
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Format for LSI-Package-Board Interoperable design
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English
08-11-2016
11-10-2023
IEC 63055:2016(E) defines a common interoperable format that will be used for the design of
a) large-scale integration (LSI),
b) packages for such LSI, and
c) printed circuit boards on which the packaged LSI are interconnected. Collectively, such designs are referred to as "LSI-Package-Board" (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This standard is published as a double logo IEC-IEEE standard.
| Committee |
TC 91
|
| DevelopmentNote |
Also numbered as IEEE 2401. Stability Date: 2021. (11/2016)
|
| DocumentType |
Standard
|
| Pages |
194
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| BS IEC 63055:2016 | Identical |
| IEEE 1364-2005 | IEEE Standard for Verilog Hardware Description Language |
| IEC 62433-2:2017 | EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE) |
| IEC 62433-4:2016 | EMC IC modelling - Part 4: Models of integrated circuits for RF immunity behavioural simulation - Conducted immunity modelling (ICIM-CI) |
| IEEE 1076-2008 REDLINE | IEEE Standard VHDL Language Reference Manual |
| IEC 62433-3:2017 | EMC IC modelling - Part 3: Models of integrated circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE) |
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