IEC PAS 62137-3:2008
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
08-11-2011
English
13-11-2008
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Procedure of selecting the applicable test method
4.1 Stress to solder joints in the field and test methods
4.2 Selection of test methods based on the shapes and
terminals of electronic components
5 Common subjects in each test method
5.1 Mounting device and materials used
5.2 Soldering condition
5.3 Accelerated endurance test
5.4 Selection of test conditions and analysis of test
results
6 Test method
6.1 Body strength test of SMD before and after the rapid
temperature change test
6.2 Cyclic bending strength test
6.3 Mechanical shear fatigue test
6.4 Cyclic drop test
6.5 Strength test of leaded component
6.6 Fillet lifting phenomenon observation of leaded
component
Annex A (informative) Condition of rapid temperature
change test
Annex B (informative) Soldered joint test by electrical
conduction
Annex C (informative) Torque shear strength test
Annex D (informative) Monotonic bending strength test
Annex E (informative) Cyclic steel ball drop strength test
Annex F (informative) Pull strength test
Annex G (informative) Creep strength test
Annex H (informative) Fillet lifting phenomenon observation
of leaded component solder joint and the life test
by electrical conduction
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