IPC-2226A:2017
Current
The latest, up-to-date edition.
Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
English, Japanese
01-09-2017
This standard establishes requirements and considerations for the design of organic and inorganic high density interconnect (HDI) printed boards and structures for component mounting and interconnections.
| DocumentType |
Standard
|
| ISBN |
978-1-61193-324-6
|
| Pages |
48
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Current
|
| Supersedes |
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