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IPC 2226 : 0

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

SECTIONAL DESIGN STANDARD FOR HIGH DENSITY INTERCONNECT (HDI) PRINTED BOARDS
Available format(s)

Hardcopy

Superseded date

11-08-2023

Language(s)

English

1 SCOPE
2 APPLICABLE DOCUMENTS
3 GENERAL REQUIREMENTS
4 MATERIALS
5 MECHANICAL/PHYSICAL PROPERTIES
6 ELECTRICAL PROPERTIES
7 THERMAL MANAGEMENT
8 COMPONENT AND ASSEMBLY ISSUES
9 HOLES/INTERCONNECTIONS
10 GENERAL CIRCUIT FEATURE
   REQUIREMENTS
11 DOCUMENTATION
12 QUALITY ASSURANCE

Sets up requirements and considerations for the design of organic and inorganic high density interconnect (HDI) printed boards and structures for component mounting and interconnections.

Committee
D-30
DevelopmentNote
To be used in conjunction with IPC 2221. (09/2005) Also available in Hardcopy format. (01/2018)
DocumentType
Standard
Pages
60
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy

IPC 7093 CHINESE : - DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
IPC 7351 GERMAN : B Basic requirements for SMT design and SMD patch guideline
IPC 7351 : B GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
IPC 7093 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
IEC PAS 62293:2001 Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)
BS EN 16602-70-12:2016 Space product assurance. Design rules for printed circuit boards
EN 16602-70-12:2016 Space product assurance - Design rules for printed circuit boards
MIL-HDBK-1861 Revision B:2013 SELECTION AND USE OF ELECTRICAL AND ELECTRONIC ASSEMBLIES, BOARDS, CARDS AND ASSOCIATED HARDWARE

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