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IPC 7351 : B

Current
Current

The latest, up-to-date edition.

GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
Published date

30-06-2010

1 SCOPE
2 APPLICABLE DOCUMENTS
3 DESIGN REQUIREMENTS
4 COMPONENT QUALITY VALIDATION
5 TESTABILITY
6 PRINTED BOARD STRUCTURE TYPES
7 ASSEMBLY CONSIDERATION FOR SURFACE MOUNT TECHNOLOGY (SMT)
8 IPC-7352 DISCRETE COMPONENTS
9 IPC-7353 GULLWING LEADED COMPONENTS, TWO SIDES
10 IPC-7354 J-LEADED COMPONENTS, TWO SIDES
11 IPC-7355 GULL-WING LEADED COMPONENTS, FOUR SIDES
12 IPC-7356 J LEADED COMPONENTS, FOUR SIDES
13 IPC-7357 POST (DIP) LEADS, TWO SIDES
14 IPC-7358 AREA ARRAY COMPONENTS (BGA, FBGA, CGA, LGA,
   Chip Array)
15 IPC-7359 NO-LEAD COMPONENTS (QFN, PQFN, SON, PSON, LCC)
16 ZERO COMPONENT ORIENTATIONS
APPENDIX A (INFORMATIVE) - TEST PATTERNS - PROCESS EVALUATIONS
APPENDIX B - IPC-7351 LAND PATTERN CALCULATOR

Defines land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SSOPs, TSSOPs, QFPs, BGAs, QFNs and SONs. Also specifies printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems and three separate land pattern geometries for each component that allow the user to select a land pattern based on desired component density.

DevelopmentNote
Included in IPC C 106, IPC C 103, IPC C 105 & IPC C 1000. (07/2009) Also available in German Language, See IPC 7351 GERMAN. (11/2011) Supersedes IPC SM 782 & IPC 7351 CD. (05/2016)
DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Current
Supersedes

BS EN 61182-2-2:2012 Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description
IPC 7801 : 0 REFLOW OVEN PROCESS CONTROL STANDARD
PD IEC/PAS 61182-12:2014 Generic requirements for printed board assembly products manufacturing description data and transfer methodology
IEC 61182-2:2006 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements
EN 61182-2-2:2012 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
IPC A 610 DANISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 SPANISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 ROMANIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 2223 CHINESE : C SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS
IPC 2221 GERMAN : B GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 7092 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS
IPC A 610 CZECH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 7093 CHINESE : - DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
IPC A 610 GERMAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 HINDI : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 ESTONIAN : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 POLISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 DUTCH : F2014 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 ITALIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 FRENCH : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 KOREAN : F2014 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 2223 GERMAN : C SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS
IPC A 610 SWEDISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 HUNGARIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 CHINESE : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 JAPANESE : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 VIETNAMESE : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 RUSSIAN : D ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 TURKISH : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 7095 : C DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
IPC 1756 : 2010 MANUFACTURING PROCESS DATA MANAGEMENT
IPC 2581 : B GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
IPC 7093 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
IEC PAS 61182-12:2014 Generic requirements for printed board assembly products manufacturing description data and transfer methodology
IPC 9701 : A PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
IPC 2584 : 2007 SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION
IEC 61182-2-2:2012 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
BS IEC 61182-2:2006 Printed board assembly products. Manufacturing description data and transfer methodology Generic requirements
BS EN 16602-70-12:2016 Space product assurance. Design rules for printed circuit boards
EN 16602-70-12:2016 Space product assurance - Design rules for printed circuit boards
IPC 9701 CHINESE : A PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
I.S. EN 61182-2-2:2012 PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV))
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN

IPC S 816 : 0 SMT PROCESS GUIDELINE AND CHECKLIST
IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC 4761 : 0 DESIGN GUIDE FOR PROTECTION OF PRINTED BOARD VIA STRUCTURES
IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC 2226 : 0 SECTIONAL DESIGN STANDARD FOR HIGH DENSITY INTERCONNECT (HDI) PRINTED BOARDS
IPC J STD 033C-1:2014 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
IPC A 610 : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 7530 : 0 GUIDELINES FOR TEMPERATURE PROFILING FOR MASS SOLDERING PROCESSES (REFLOW AND WAVE)
IPC J STD 002 : D SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 1902 : 1998 GRID SYSTEMS FOR PRINTED CIRCUITS
IPC 7525 : B STENCIL DESIGN GUIDELINES
IPC 7711/21 : B REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
IPC 9701 : A PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
IPC 2581 : B GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
IPC 7095 : C DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
IPC SM 785 : 0 GUIDELINES FOR ACCELERATED RELIABILITY TESTING OF SURFACE MOUNT ATTACHMENTS
IPC 6012 : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS

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