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IPC J STD 002 : D

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
Available format(s)

Hardcopy

Superseded date

23-08-2019

Language(s)

English

Published date

24-06-2013

1 PREFACE
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 TEST PROCEDURES
5 NOTES
APPENDIX A - Critical Component Surfaces
APPENDIX B - Evaluation Aids
APPENDIX C - Calculation of Maximum
             Theoretical Force
APPENDIX D - Calculation of Integrated Value
             of Area of the Wetting Curve
APPENDIX E - Informative Annex
APPENDIX F - J-STD-002/J-STD-003 Activated
             Solderability Test Flux Rationale
             Committee Letter
APPENDIX G - Graphical Representations:
             Progression of Solder Wetting
             Curve Parameters As Measured
             By Wetting Balance Testing
APPENDIX H - Test Protocol for Wetting

Describes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs.

Committee
5-20
DevelopmentNote
Supersedes IPC S 805, EIA IS 49 & EIA 638. Included in IPC C 103 & IPC C 1000. Supersedes EIA 364-52. (07/2009) Also available in Chinese Language, See separate record J STD 002 CHINESE. (05/2016) Jointly Published by IPC, EIA and JEDEC. (07/2013) Supersedes EIA JESD 22-B102. (03/2016) Also available in Hardcopy format. (03/2018)
DocumentType
Standard
Pages
64
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy
Supersedes

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