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IPC CH 65 : B

Current
Current

The latest, up-to-date edition.

GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
Published date

27-07-2011

1 OVERVIEW
2 APPLICABLE DOCUMENTS
3 ASSEMBLY CLEANING VALUE AND APPLICABILITY
4 DESIGNING ASSEMBLIES FOR CLEANING
5 MATERIALS COMPATIBILITY
6 PROCESS DEVELOPMENT AND VERIFICATION
7 CONTAMINATION AND ITS EFFECTS ON PWBS
8 ASSEMBLY RESIDUES/CLEANING CONSIDERATIONS
9 ENVIRONMENTAL CONSIDERATIONS
10 SOLVENT CLEANING AGENTS
11 SEMI-AQUEOUS CLEANING AGENTS, EQUIPMENT, AND PROCESS
   OPTIMIZATION
12 AQUEOUS CLEANING AGENTS, EQUIPMENT, AND PROCESS INTEGRATION
13 CLEANING FOR REWORK, REPAIR, AND RESTORATION OPERATIONS

Discusses the relationship between materials, processes, and contaminants in fabrication and assembly operations. Also addresses cleanliness assessment and process control in relation to cleanliness.

DevelopmentNote
Included in IPC C 108. (06/2008) Included in IPC C 1000. (07/2008) Supersedes IPC SC 60, IPC SA 61, IPC AC 62 & IPC SM 839. (07/2011) Also available in Chinese language, See IPC CH 65 CHINESE. (01/2014)
DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Current
Supersedes

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