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IPC 9191 : 0

Current
Current

The latest, up-to-date edition.

GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC)
Available format(s)

Hardcopy

Language(s)

English

Published date

19-01-2022

1 SCOPE
  1.1 Subject of this Standard
  1.2 Aspects Covered
  1.3 Field of Application
  1.4 Interpretation
2 NORMATIVE REFERENCE(S)
  2.1 IPC
3 TERM(S) AND DEFINITION(S)
4 SPC OBJECTIVES AND ORGANIZATION
  4.1 SPC Objectives
  4.2 Financial Motive for SPC
  4.3 Relationships
  4.4 SPC Organization
5 CONDITIONS FOR STATISTICAL PROCESS CONTROL
  5.1 Management Support
  5.2 Understanding of SPC Tools and Methods
  5.3 Quality System
6 ELEMENTS OF A STATISTICAL PROCESS CONTROL SYSTEM
  6.1 Process Documentation and Control Plan
  6.2 Definition of Process Targets and Limits
  6.3 Measurement System Evaluation and Control
  6.4 Documented Work Instructions
  6.5 Employee Training and Involvement in Process Data
  6.6 Process Data Recording and Collection
  6.7 Traceability and Production Sequence Identification
  6.8 Subcontractor Performance Evaluation
  6.9 Process Input Sequencing
  6.10 Process Logs
  6.11 Process Reliability
  6.12 Process Output Monitoring System
  6.13 Process Control System
  6.14 Short-Term Variability Assessment
  6.15 Long-Term Variability Assessment
  6.16 Communicating the results of Process Analysis
  6.17 Customer Information System
  6.18 Internal SPC Audits
  6.19 SPC Projects and Teams
  6.20 Process Improvement, Optimization and Troubleshooting

Outlines the SPC philosophy, implementation strategies, and tools and techniques. Also describes the provisions for implementing an SPC system in the electronics industry. The tools and techniques covered in this guideline are also used for relating process control and capability to final product requirements.

DevelopmentNote
Supersedes IPC PC 90. (11/2000)
DocumentType
Standard
Pages
52
PublisherName
Institute of Printed Circuits
Status
Current
Supersedes

MIL-PRF-31032 Revision C:2016 Printed Circuit Board/Printed Wiring Board, General Specification for
I.S. EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
BS EN 61191-3:2017 Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
IPC D 326 : A INFORMATION REQUIREMENTS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND OTHER ELECTRONIC ASSEMBLIES
IPC AJ 820 : A ASSEMBLY AND JOINING HANDBOOK
IPC J STD 001 SWEDISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 RUSSIAN : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC WHMA A 620 HUNGARIAN : B REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC J STD 001 TURKISH : E2010 REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 POLISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 600 SWEDISH : H ACCEPTABILITY OF PRINTED BOARDS
IPC A 600 JAPANESE : H ACCEPTABILITY OF PRINTED BOARDS
IPC A 600 CHINESE : G ACCEPTABILITY OF PRINTED BOARDS
IPC WHMA A 620 TURKISH : B2012 AMD 1 2013 REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC WHMA A 620 HEBREW : B2012 AMD 1 2013 REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC A 600 GERMAN : H ACCEPTABILITY OF PRINTED BOARDS
IPC 7092 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS
IPC A 600 POLISH : H ACCEPTABILITY OF PRINTED BOARDS
IPC A 600 RUSSIAN : H ACCEPTABILITY OF PRINTED BOARDS
IPC 7912 : A END-ITEM DPMO FOR PRINTED CIRCUIT BOARD ASSEMBLIES
IPC WHMA A 620 SPANISH : B REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC WHMA A 620 CHINESE : B REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC WHMA A 620 VIETNAMESE : B2012 REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC 4411 : A SPECIFICATION AND CHARACTERIZATION METHODS FOR NONWOVEN PARA-ARAMID REINFORCEMENT
IPC CH 65 : B GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
IPC 4204 CHINESE : A2011 AMD 1 2013 FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY
IPC DPMO 202 : 2002 IPC 7912/9261 END ITEM AND IN-PROCESS DPMO SET
IPC 4412 : B SPECIFICATION FOR FINISHED FABRIC WOVEN FROM 'E' GLASS FOR PRINTED BOARDS
IPC CH 65 CHINESE : B GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
IPC A 630 CHINESE : - ACCEPTABILITY STANDARD FOR MANUFACTURE, INSPECTION AND TESTING OF ELECTRONIC ENCLOSURES
IPC J STD 001 HUNGARIAN : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC 4412 CHINESE : B SPECIFICATION FOR FINISHED FABRIC WOVEN FROM 'E' GLASS FOR PRINTED BOARDS
IPC J STD 001 GERMAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC WHMA A 620 POLISH : B REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC 4204 : A FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY
IPC 4202 CHINESE : A FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED CIRCUITRY
IPC 9261 : A IN-PROCESS DPMO AND ESTIMATED YIELD FOR PCAS
IPC J STD 001 ROMANIAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 600 FRENCH : H ACCEPTABILITY OF PRINTED BOARDS
IPC J STD 001 DANISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC 4101 CHINESE : C2009 SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC 4101 GERMAN : C SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC 9199 : 0 STATISTICAL PROCESS CONTROL (SPC) QUALITY RATING
IPC WHMA A 620 ESTONIAN : B2012 AMD 1 2013 REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC WHMA A 620 KOREAN : B2012 AMD 1 2013 REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
DD IEC/PAS 61249-6-3:2011 Specification for finished fabric woven from “E?? glass for printed boards
IPC 9194 : 0 IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC) APPLIED TO PRINTED BOARD ASSEMBLY MANUFACTURE GUIDELINE
IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
I.S. EN 61191-4:2017 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
IPC J STD 001 CHINESE : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
I.S. EN 61191-3:2017 PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
IPC J STD 001 SPANISH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC WHMA A 620 DANISH : B REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
BS EN 61191-4:2017 Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies
EIA 557 : 2006 STATISTICAL PROCESS CONTROL SYSTEMS
IPC 4562 : A METAL FOIL FOR PRINTED BOARD APPLICATIONS
IPC A 630 : 0 ACCEPTABILITY STANDARD FOR MANUFACTURE, INSPECTION AND TESTING OF ELECTRONIC ENCLOSURES
IEC PAS 61249-6-3:2011 Specification for finished fabric woven from "E" glass for printed boards
15/30327712 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
BS EN 61191-2:2017 Printed board assemblies Sectional specification. Requirements for surface mount soldered assemblies
IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
IPC 4562 CHINESE : A METAL FOIL FOR PRINTED BOARD APPLICATIONS
EN 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
EN 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
EN 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

IPC 6011 : 0 GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS
IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC 4104 : 1999 SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS
IPC 4110 : 0 SPECIFICATION AND CHARACTERIZATION METHODS FOR NONWOVEN CELLULOSE BASED PAPER FOR PRINTED BOARDS
IPC 4130 : 0 SPECIFICATION AND CHARACTERIZATION METHODS FOR NONWOVEN 'E' GLASS MATERIALS
IPC 9261 : A IN-PROCESS DPMO AND ESTIMATED YIELD FOR PCAS
IPC 7912 : A END-ITEM DPMO FOR PRINTED CIRCUIT BOARD ASSEMBLIES

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