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IPC J STD 001 : F

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
Available format(s)

Hardcopy

Superseded date

21-02-2019

Published date

28-08-2014

1 GENERAL
2 APPLICABLE DOCUMENTS
3 MATERIALS, COMPONENTS AND EQUIPMENT REQUIREMENTS
4 GENERAL SOLDERING AND ASSEMBLY REQUIREMENTS
5 WIRES AND TERMINAL CONNECTIONS
6 THROUGH-HOLE MOUNTING AND TERMINATIONS
7 SURFACE MOUNTING OF COMPONENTS
8 CLEANING PROCESS REQUIREMENTS
9 PCB REQUIREMENTS
10 COATING, ENCAPSULATION AND STAKING (ADHESIVE)
11 WITNESS (TORQUE/ANTI-TAMPERING) STRIPE
12 PRODUCT ASSURANCE
13 REWORK AND REPAIR
Appendix A - Guidelines for Soldering Tools and Equipment
Appendix B - Minimum Electrical Clearance - Electrical
             Conductor Spacing
APPENDIX C - J-STD-001 Guidance on Objective Evidence of
             Material Compatibility

Specifies materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies.

Committee
5-20
DevelopmentNote
Supersedes IPC S 815. Included in IPC C 103 & IPC C 1000. E2010 edition is still available in Swedish, Hungarian, Polish & Turkish Languages, See separate records. F2014 edition is still available in Chinese, German, French, Danish, Italian, Japanese, Romanian, Russian & Spanish Languages, See separate records. (05/2016) Also available in Hardcopy format. (01/2018)
DocumentType
Standard
Pages
102
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy
Supersedes

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BS EN 61188-5-6:2003 Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides
PD IEC/TS 62647-23:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
IEC PAS 62647-1:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
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BS EN 61191-2:2017 Printed board assemblies Sectional specification. Requirements for surface mount soldered assemblies
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IEC TS 62647-22:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
IEC PAS 62647-22:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
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IEC TS 62647-2:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin
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IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
IPC J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
AWS WHC2.13 : 0 WELDING PROCESSES - PART 1, WELDING HANDBOOK, 9TH EDITION, VOL. 2 - CHAPTER 13: SOLDERING
MIL-PRF-32070 Revision A:2012 TEST PROGRAM SETS
MIL-STD-1568 Revision D:2015 Materials and Processes for Corrosion Prevention and Control in Aerospace Weapons Systems
EN 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
PD IEC/TS 62647-22:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
BS EN 61188-5-2:2003 Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
MIL-DTL-18714 Revision F:2012 PRIMER, ELECTRIC, MARK 45 MOD 1
EN 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

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