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IEC PAS 62647-22:2011

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

25-09-2013

Language(s)

English

Published date

28-07-2011

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Approach
5 General Pb-Free Solder Alloy Behavior
6 System Level Service Environment
7 High Performance Electronics Testing
8 Solder Joint Reliability Considerations
9 Piece-parts
10 Printed Circuit Boards
11 Printed Circuit Board Assembly
12 Module Assembly Considerations
13 Manufacturing Resources
14 Aerospace Wiring/Cabling Considerations
15 Rework/Repair
16 Generic Life Testing
17 Similarity Analysis
Annex A - Equipment Service Environmental Definition
Bibliography

IEC/PAS 62647-22:2011(E) is intended for use as technical guidance by Aerospace system Suppliers, e.g., Aerospace system Original Equipment Manufacturers and Aerospace system maintenance facilities, in developing and implementing designs and processes to ensure the continued performance, quality, reliability, safety, airworthiness, configuration control, affordability, maintainability, and supportability of high performance aerospace systems (subsequently referred to as AHP) both during and after the transition to Pb-Free electronics.

DevelopmentNote
Stability Date: 2014. (10/2012)
DocumentType
Miscellaneous Product
Pages
69
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy

Standards Relationship
NEN NPR IEC/PAS 62647-22 : 2011 Identical

IEC PAS 62647-3:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
PD IEC/TS 62647-1:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan
IEC PAS 62647-23:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
GEIA HB 0005-1 : 2006 PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS
IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
PD IEC/TS 62647-2:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Mitigation of deleterious effects of tin
IEC TS 62647-2:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin
DD IEC PAS 62647-23 : DRAFT AUG 2011 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
DD IEC PAS 62647-3 : DRAFT SEP 2011 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 3: PERFORMANCE TESTING FOR SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES

IPC J STD 609 : A MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
IEC PAS 62647-2:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin
IPC 4552 : 0 PERFORMANCE SPECIFICATION FOR ELECTROLESS NICKEL/IMMERSION GOLD (ENIG) PLATING FOR PRINTED BOARDS
IPC 4553 : A SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS
IEC PAS 62647-3:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC JP002 : 0 JEDEC/IPC CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE
IPC CC 830 : B QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES
MIL-I-46058 Revision C:1972 Insulating Compound, Electrical (for Coating Printed Circuit Assemblies)
ASTM G 85 : 2011 : REDLINE Standard Practice for Modified Salt Spray (Fog) Testing
IEC PAS 62647-1:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
IPC J STD 006 : C REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
IPC TM 650 : 0 TEST METHODS MANUAL
IPC J STD 033C-1:2014 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
GEIA HB 0005-3 : 2008 REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
IPC A 610 : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
GEIA STD 0005-2 : 2012 MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
IEC PAS 62647-23:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
IPC J STD 002 : D SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
GEIA HB 0005-1 : 2006 PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 1066 : 0 MARKING, SYMBOLS AND LABELS FOR IDENTIFICATION OF LEAD-FREE AND OTHER REPORTABLE MATERIALS IN LEAD-FREE ASSEMBLIES, COMPONENTS AND DEVICES
GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
IPC 9701 : A PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
GEIA STD 0006 : 2008 REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS
IEC PAS 62647-21:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics
IPC 4554 : 0 SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS
ARINC 671 : 2006 GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR
IPC 7095 : C DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
IPC 1752 : A-2 MATERIALS DECLARATION MANAGEMENT

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