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IPC A 610 : F

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
Available format(s)

Hardcopy

Superseded date

12-04-2019

Language(s)

English

1 General
2 Applicable Documents
3 Handling Electronic Assemblies
4 Hardware
5 Soldering
6 Terminal Connections
7 Through-Hole Technology
8 Surface Mount Assemblies
9 Component Damage
10 Printed Circuit Boards and
   Assemblies
11 Discrete Wiring
12 High Voltage
Appendix A - Minimum Electrical
             Clearance - Electrical
             Conductor Spacing
Index

Describes acceptance requirements for the manufacture of electrical and electronic assemblies.

Committee
7-30
DevelopmentNote
Included in IPC C 1036 & IPC C 1000. D2005 Edition is still available in Finnish Language, See separate record. E2010 Edition is still available in Hindi, Czech, Italian, Turkish & Estonian Languages, See separate records. F2014 Edition is still available in German, Japanese, Swedish, Polish, Dutch, Chinese, Danish, Hebrew, Hungarian, Korean, Romanian, Vietnamese, Spanish & Russian Languages, See separate records. (08/2016) Also available in Hardcopy format. (01/2018)
DocumentType
Standard
Pages
440
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy
Supersedes

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IEC TS 62647-22:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
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DD IEC PAS 62647-23 : DRAFT AUG 2011 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
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EN 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
PD IEC/TS 62647-22:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
EN 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
EN 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

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