IPC HDBK 610 : 2002
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to C Comparison)
English
01-09-2002
06-05-2026
1 Acceptability of Electronic Assemblies
1.1 Scope
1.2 Purpose
1.3 Specialized Designs
1.4 Terms & Definitions
1.5 Examples and Illustrations
1.6 Inspection Methodology
1.7 Verification of Dimensions
1.8 Magnification Aids and Lighting
2 Applicable Documents
2.1 IPC Documents
2.2 Joint Industry Documents
2.3 EOS/ESD Association Documents
2.4 Electronics Industries Alliance Documents
2.5 International Electrotechnical Commission
Documents
2.6 Federal Standards
3 Handling Electronic Assemblies
3.1 Electrical Overstress (EOS) Damage
Prevention
3.2 Electrostatic Discharge (ESD) Damage
Prevention
3.3 EOS/ESD Safe Workstation/EPA
3.4 Handling
4 Mechanical Assembly
4.1 Hardware
4.2 Hardware Mounting
4.3 Swaged Hardware
4.4 Component Mounting
4.5 Connectors, Handles, Extractors
4.6 Heat Sink
4.7 Terminals - Edge Clip
4.8 Connector Pins
5 Component Installation Location/
Orientation
5.1 Orientation
5.2 Mounting
5.3 Lead Forming
5.4 Damage
5.5 Terminals
5.6 Insulation
5.7 Conductor
6 Soldering
6.1 Soldering Acceptability Requirements
6.2 Lead Protrusion
6.3 Plated-Through Holes (PTH) (Supported
Holes)
6.4 Unsupported Holes
6.5 Other
6.6 Terminals
6.7 Insulation
6.8 High Voltage
6.9 Connector Pins - Press-Fit Pins
6.10 Gold Fingers
7 Cleanliness
7.1 Flux Residues
7.2 Particulate Matter
7.3 Chlorides, Carbonates, and White Residues
7.4 Flux Residues - No Clean Process
Appearance
7.5 Surface Appearance
8 Marking
8.1 Etched Marking (including Hand Printing)
8.2 Screened Marking
8.3 Stamped Marking
8.4 Laser Marking
8.5 Labels
9 Coatings
9.1 Conformal Coating
9.2 Solder Resist Coating
10 Laminate Conditions
10.1 Introduction
10.2 Laminate Damage
10.3 Flexible and Rigid-Flex Printed Wiring
10.4 Solder Resist Discoloration
10.5 Burns
10.6 Bow and Twist
10.7 Conductor/Land Damage
11 Discrete Wiring
11.1 Solderless Wrap
11.2 Jumper Wires
12 Surface Mount Assemblies
12.1 Staking Adhesive
12.2 Solder Joints
12.3 Chip Component - Termination Variations
12.4 SMT Soldering Anomalies
Appendix A Electrical Conductor Spacing Appendix A
Appendix B Metric Conversion Information, Appendix H-1
Appendix C Comparison of IPC-A-610 Revision B to C
Appendix D U.S. Department of Defense Adoption
Notice
This standard is a collection of visual quality acceptability requirements for electronic assemblies.
| Committee |
7-30
|
| DevelopmentNote |
To be used in conjunction with IPC HDBK 001 and J STD 001. (06/2003) Also available in CD-ROM format. (09/2005) 2005 version incorporates Amendment 1 to 2002 version. (12/2005)
|
| DocumentType |
Standard
|
| Pages |
124
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| SupersededBy |
| BS EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
| EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC HDBK 001 : E | HANDBOOK AND GUIDE TO SUPPLEMENT J-STD-001 |
| IPC EA 100 K : 2001 | ELECTRONIC ASSEMBLY REFERENCE SET |
| IPC A 610 : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC E 500 : LATEST | IPC ELECTRONIC DOCUMENT COLLECTION |