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IPC 7526 : 2007

Current
Current

The latest, up-to-date edition.

STENCIL AND MISPRINTED BOARD CLEANING HANDBOOK
Available format(s)

Hardcopy

Language(s)

English

Published date

13-02-2007

1 INTRODUCTION
   1.1 Scope
   1.2 Purpose
   1.3 Overview
   1.4 Problem Statement
   1.5 Common Production Problems
2 BIBLIOGRAPHY OF DOCUMENTS, SPECIFICATIONS AND
   REFERENCES
   2.1 IPC
   2.2 Joint Industry Standards
   2.3 American Standards for Testing Materials
   2.4 Federal Laws and Standards
   2.5 Department of Defense
   2.6 Occupational Safety and Health Administration
   2.7 Environmental Protection Agency (EPA)
   2.8 Department of Transportation
   2.9 National Fire Protection Association (NFPA)
        2.9.1 Air Quality Management Standards (AQMD)
3 STENCIL CLEANING PROCESS
   3.1 Objectives for the Cleaning Process
   3.2 Substrate
   3.3 Tools
   3.4 Pallets
4 MISPRINTED CIRCUIT BOARD CLEANING
   4.1 Solder Paste
   4.2 Adhesives
   4.3 PCB Cleaning Process Considerations
5 CONTAMINANT TYPES AND REMOVAL CHARACTERISTICS
   5.1 Polar Residues
   5.2 Nonpolar Water Soluble Residues
   5.3 Nonpolar Water Insoluble Residues
   5.4 Nonreflowed Solder Paste
   5.5 Reflowed Flux Residue
   5.6 Uncured (Wet) SMT Adhesive
   5.7 Insoluble Residues
6 STENCIL CLEANING PROCESSES
   6.1 Under Stencil Wiping Process
   6.2 Manual Stencil Cleaning
   6.3 Semimanual Stencil Cleaning
   6.4 Single Chamber Equipment
   6.5 Ultrasonic Agitation
   6.6 Automated Ultrasonic Stencil Cleaning
   6.7 Rotating Wand/Fixed Nozzle Spray-In-Air Cleaning
   6.8 Automated Ultrasonic Sponge Stencil Cleaning
   6.9 Multifunctional Batch System for Stencils, Boards,
        and Maintenance Cleaning
7 CLEANING CHEMISTRY OPTIONS
   7.1 Cleaning Chemistry Selection
   7.2 Chemistry Choices and the Cleaning Process
   7.3 Solvent Cleaning
   7.4 Aqueous Cleaning
   7.5 Semiaqueous
8 CLEANING PROCESS CONSIDERATIONS
   8.1 Common Rules that Center on Aqueous Cleaning
        8.1.1 Temperature
        8.1.2 Energy
        8.1.3 Solvency/Concentration
        8.1.4 Time
        8.1.5 Cleanliness
   8.2 Drying
9 EQUIPMENT ACCESSORIES
   9.1 Equipment Accessories
   9.2 Process Control Accessories
   9.3 Operation Accessories
        9.3.1 Pumps
        9.3.2 Heaters
        9.3.3 Filters
        9.3.4 Dryers
        9.3.5 Ion Exchange and Carbon Media
        9.3.6 Evaporators
        9.3.7 Exhaust/Venting Systems
        9.3.8 Cooling Coils
        9.3.9 Fixture/Basket Accessories
   9.4 Compatibility Constraints with Cleaning Solutions
10 ENVIRONMENTAL
   10.1 Air Emissions
   10.2 Wastewater
   10.3 Solid Waste
APPENDIX A Terms and Definitions

Addresses the removal of solder paste and uncured/unreacted SMT adhesives from stencils, misprinted printed circuit boards (PCBs) and application tools connected to the soldering paste application processes.

Committee
5-30
DevelopmentNote
Included in IPC C 108 & IPC C 1000. (07/2008) Also available in Russian Language, See IPC 7526 RUSSIAN. (10/2012)
DocumentType
Standard
Pages
32
PublisherName
Institute of Printed Circuits
Status
Current

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CFR 40(PTS300-399) : JUL 2017 PROTECTION OF ENVIRONMENT - ENVIRONMENTAL PROTECTION AGENCY
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CFR 40(PTS260-265) : JUL 2017 PROTECTION OF ENVIRONMENT - ENVIRONMENTAL PROTECTION AGENCY
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IPC A 610 : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
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IPC J STD 005 : A REQUIREMENTS FOR SOLDERING PASTES
NFPA 35 : 2016 MANUFACTURE OF ORGANIC COATINGS
CFR 40(PTS150-189) : JUL 2017 PROTECTION OF ENVIRONMENT - ENVIRONMENTAL PROTECTION AGENCY
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CFR 40(PTS87-135) : JUL 2000 PROTECTION OF ENVIRONMENT - ENVIRONMENTAL PROTECTION AGENCY

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