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IPC 3406 : 0

Current

Current

The latest, up-to-date edition.

GUIDELINES FOR ELECTRICALLY CONDUCTIVE SURFACE MOUNT ADHESIVES

Published date

01-07-1996

1.0 SCOPE
    1.1 Introduction
2.0 APPLICABLE DOCUMENTS
    2.1 IPC
3.0 BASIC TYPES AND FEATURES
    3.1 Benefits and Limitations of Conductive
        Adhesives
4.0 MATERIALS
    4.1 Types of Polymers
    4.2 Fillers
5.0 BASIC TYPES OF CONDUCTIVE ADHESIVES
    5.1 Intrinsically Conductive Polymers (ICP)
    5.2 Isotropically Conductive Adhesives
    5.3 Anisotropic Conductive Adhesives
    5.4 Nonconductive Adhesives Used for Electrical
        Connections
6.0 APPLICATION AND ASSEMBLY PROCESS
    6.1 Applying Isotropic Pastes
    6.2 Applying Anisotropic Pastes
    6.3 Applying Anisotropic Films
    6.4 Component Placement
    6.5 Hardening the Adhesive
    6.6 Special Operations
7.0 REPAIR
    7.1 Thermoplastic Systems
    7.2 Thermosets
    7.3 Anisotropics
8.0 PERFORMANCE
    8.1 Mechanical
    8.2 Electrical
    8.3 Chemical
    8.4 Compatibility
9.0 TESTING DIFFERENCES COMPARED TO SOLDER
    9.1 Printability/Applicability
    9.2 Hardening/Curing/Polymerization
    9.3 Mechanical
    9.4 Electrical
    9.5 Inspection
Figures
Figure 3-1 Metallurgic solder (shown only as tin for
           simplicity)
Figure 3-2 Electrical paths in isotropic conductive
           adhesive
Figure 3-3 Isotropic conductive adhesive joint
Figure 3-4 Anisotropic conductive adhesives junctions
Figure 3-5 Result of evaluating conductive adhesive
           using a screen designed for solder paste

Contains definitions for selecting electrically conductive adhesives (as alternatives to solder) for use in assembly of components to PCBs. Covers anisotropic types, thermosets, and thermoplastics.

DevelopmentNote
Included in IPC C 103 & IPC C 1000. (07/2008)
DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Current

BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
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IPC 7526 : 2007 STENCIL AND MISPRINTED BOARD CLEANING HANDBOOK
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IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

IPC CA 821 : 0 GENERAL REQUIREMENTS FOR THERMALLY CONDUCTIVE ADHESIVES
IPC S 100 : LATEST STANDARDS AND SPECIFICATIONS MANUAL
IPC 3408 : 0 GENERAL REQUIREMENTS FOR ANISOTROPICALLY CONDUCTIVE ADHESIVES FILMS
IPC SM 817 : A GENERAL REQUIREMENTS FOR DIELECTRIC SURFACE MOUNTING ADHESIVES
IPC M 103 : LATEST STANDARDS FOR SURFACE MOUNT ASSEMBLIES MANUAL

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