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IPC J STD 005 : A

Current
Current

The latest, up-to-date edition.

REQUIREMENTS FOR SOLDERING PASTES

1 GENERAL
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 QUALITY ASSURANCE PROVISIONS
5 PREPARATION FOR DELIVERY
6 NOTES
APPENDIX A - Test Report on Solder Paste

Specifies requirements for qualification and characterization of solder paste. It references test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes.

DevelopmentNote
Supersedes QQ S 571, IPC SP 819, QPL 14256 and QPL QQ S 571. Included in IPC C 103 & IPC C 1000. (07/2009) 1995 Edition is still available in Japanese Language, See J STD 005 JAPANESE. (02/2012) Also available in Russian Language, See J STD 005 RUSSIAN. (11/2012) Also available in Chinese Language, See J STD 005 CHINESE. (03/2013) Also available in Hardcopy format. (01/2018)
DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Current
Supersedes

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IPC J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
IPC TM 650 : 0 TEST METHODS MANUAL
IPC A 20/21 : 1996 STANDARD PITCH STENCIL PATTERN FOR SLUMP - GERBER FORMAT
ISO 9001:2015 Quality management systems — Requirements

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