IPC A 20/21 : 1996
Current
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STANDARD PITCH STENCIL PATTERN FOR SLUMP - GERBER FORMAT
Published date
01-02-1996
Publisher
These Gerber electronic files include patterns for development of solder paste stencils by laser or chemical etching. Gives land widths of 0.4 mm, 0.63 mm and 1.25 mm so as to evaluate solder paste slump. J STD 005 is included with each order.
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