IEC TS 62647-1:2012
Current
Current
The latest, up-to-date edition.
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
Available format(s)
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
Language(s)
English
Published date
09-08-2012
Publisher
$554.84
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Symbols and abbreviated terms
5 Objectives
6 Technical requirements
7 Plan administrative requirements
Annex A (informative) - Template for tailoring
requirements of IEC/TS 62647-1
Annex B (informative) - Requirements matrix
for IEC/TS 62647-1
Annex C (informative) - Guidance on configuration control
and product identification
Bibliography
IEC/TS 62647-1:2012(E) defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that aerospace and defence electronic systems containing Pb-free solder, piece parts, and PWBs will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance. Keywords: avionics, lead-free solder
| Committee |
TC 107
|
| DevelopmentNote |
Supersedes IEC PAS 62647-1. (08/2012) Stability Date: 2017. (10/2012)
|
| DocumentType |
Technical Specification
|
| Pages |
32
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NEN NPR IEC/TS 62647-1 : 2012 | Identical |
| DIN IEC/TS 62647-1 : 2013 | Identical |
| PD IEC/TS 62647-1:2012 | Identical |
| DIN IEC/TS 62647-1;DIN SPEC 42647-1:2013-07 | Identical |
| IEC TS 62239-2:2017 | Process management for avionics - Management plan - Part 2: Preparation and maintenance of an electronic COTS assembly management plan |
| IEC TS 62239-1:2015 | Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan |
| IEC TS 62647-23:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| IEC TS 62647-22:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| PD IEC/TS 62647-3:2014 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Performance testing for systems containing lead-free solder and finishes |
| PD IEC/TS 62647-21:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Program management. Systems engineering guidelines for managing the transition to lead-free electronics |
| PD IEC/TS 62239-2:2017 | Process management for avionics. Management plan Preparation and maintenance of an electronic COTS assembly management plan |
| PD IEC/TS 62647-2:2012 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Mitigation of deleterious effects of tin |
| PD IEC/TS 62239-1:2015 | Process management for avionics. Management plan Preparation and maintenance of an electronic components management plan |
| IEC TS 62647-3:2014 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes |
| EIA STD 4899 : 2017-05 | REQUIREMENTS FOR AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
| PD IEC/TS 62647-23:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| PD IEC/TS 62647-22:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines |
| IEC TS 62647-21:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics |
| IEC TS 62647-2:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin |
| IPC J STD 609 : A | MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
| IEC PAS 62647-2:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin |
| GEIA HB 0005-2 : 2007 | TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
| IPC WP 006 : 2003 | ROUND ROBIN TESTING AND ANALYSIS - LEAD-FREE ALLOYS - TIN, SILVER AND COPPER |
| GEIA STD 0005-3 : 2013 | PERFORMANCE TESTING FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC INTERCONNECTS CONTAINING PB-FREE SOLDER AND FINISHES |
| IEC PAS 62647-3:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes |
| GEIA HB 649 : 2005 | CONFIGURATION MANAGEMENT STANDARD IMPLEMENTATION GUIDE |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC 2225 : 0 | SECTIONAL DESIGN STANDARD FOR ORGANIC MULTICHIP MODULES (MCM-L) AND MCM-L ASSEMBLIES |
| IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| IEC PAS 62647-22:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| GEIA HB 0005-3 : 2008 | REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
| IPC A 610 : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| GEIA STD 0005-2 : 2012 | MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
| IEC PAS 62647-23:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| IPC J STD 005 : A | REQUIREMENTS FOR SOLDERING PASTES |
| IPC J STD 002 : D | SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES |
| GEIA HB 0005-1 : 2006 | PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| IPC 1065 : 0 | MATERIAL DECLARATION HANDBOOK |
| GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
| IPC 2222 : A | SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
| IPC 9701 : A | PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
| IPC J STD 028 : 0 | PERFORMANCE STANDARD FOR CONSTRUCTION OF FLIP CHIP AND CHIP SCALE BUMPS |
| IEC PAS 62647-21:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics |
| IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
| IPC 6013 : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS |
| IPC 6015 : 0 | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR ORGANIC MULTICHIP MODULE MOUNTING AND INTERCONNECTING STRUCTURES |
| GEIA EIA649B:2011 | CONFIGURATION MANAGEMENT STANDARD |
| ASME Y14.100 : 2017 | ENGINEERING DRAWING PRACTICES - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |
| IPC J STD 020D-1:2008 | MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES |
| IPC 2223 : C | SECTIONAL DESIGN STANDARD FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS |
| IEC TS 62647-2:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin |
| IPC 6012 : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
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