GEIA STD 0005-2 : 2012
Current
The latest, up-to-date edition.
MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
Hardcopy , PDF
English
01-01-2012
Foreword
Introduction
1 Scope
2 Terms and Definitions
3 Requirements
4 Implementation Methods
Annex A - Guidance on Control Levels, Risk Assessment,
and Mitigation Evaluation
Annex B - Technical Guide on Detection Methods,
Mitigation Methods, and Methods for Limiting Impact
of Pb-free Tin Finishes
Annex C - Tin Whisker Inspection
Annex D - Analysis and Risk Assessment Guidance
Annex E - Whiskers Growing from Solder Joint Fillets
and Bulk Solder
Annex F - Bibliography
Specifies processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin finishes in electronic systems.
| Committee |
G-12
|
| DocumentType |
Standard
|
| Pages |
79
|
| PublisherName |
Government Electronics & Information Technology Association
|
| Status |
Current
|
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