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IPC WP 006 : 2003

Withdrawn
Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

ROUND ROBIN TESTING AND ANALYSIS - LEAD-FREE ALLOYS - TIN, SILVER AND COPPER
Withdrawn date

13-09-2023

Published date

23-11-2012

MISSION STATEMENT
SOLDER PRODUCTS VALUE COUNCIL MEMBERS
Introduction and Statement of Problem
Methodology
Alloy Choice
Test Regimen for Alloy Comparison
Assembly Performance Comparison
Assembly Performance Testing: Statistical Procedures Used
Examples of Statistical Analysis
Conclusions Based on Assembly Performance Testing
LONG TERM RELIABILITY COMPARISON
Third Party Solder Paste Testing
Test Vehicle Assembly
Inspection, Test, Repair, and Data Logging
Long Term Thermal Cycling
Periodic Metallographic Analysis
Data Analysis
Appendix 1 - Data Tables of Testing Participants
Appendix 2 - IPC-TM-650, 2.4.14.2 Liquid Flux Activity
             Wetting Balance Method, Using Flux Defined
             in J-STD-003A, 3.2.2
Appendix 3 - IPC-TM-650, 2.4.46, Spread Test, Liquid or
             Extracted Solder Flux, Solder Paste and
             Extracted Cored Wires or Preforms

Describes round robin test program on the assembly properties of three lead free solder alloys.

DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Withdrawn

IPC SPVC2005-CD : 2005 ROUND ROBIN TESTING AND ANALYSIS OF LEAD FREE SOLDER PASTES WITH ALLOYS OF TIN, SILVER AND COPPER
PD IEC/TS 62647-1:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan
GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
IEC PAS 62647-1:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
PD IEC/PAS 62647-1:2011 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management

IPC SPVC2005-CD : 2005 ROUND ROBIN TESTING AND ANALYSIS OF LEAD FREE SOLDER PASTES WITH ALLOYS OF TIN, SILVER AND COPPER

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