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IPC SM 785 : 0

Current
Current

The latest, up-to-date edition.

GUIDELINES FOR ACCELERATED RELIABILITY TESTING OF SURFACE MOUNT ATTACHMENTS
Published date

01-11-1992

1.0 SCOPE
     1.1 Purpose
     1.2 Document Organization
2.0 APPLICABLE DOCUMENTS
     2.1 IPC
     2.2 Joint Industry Standards
     2.3 Military
     2.4 Other Publications
3.0 REQUIREMENTS
     3.1 Terms and Definitions
     3.2 Reliability Concepts and Understanding
     3.3 Reliability Assurance
     3.4 Damage/Failure Mechanisms
     3.5 Application Considerations
4.0 SURFACE MOUNT SOLDER ATTACHMENT FATIGUE BEHAVIOR
     AND RELIABILITY PREDICTION
     4.1 General Fatigue Life Models
     4.2 Solder Joint Fatigue
     4.3 Fatigue Behavior of Solder Joints
     4.4 Acceleration Factors/Acceleration Transform
     4.5 Statistical Considerations
5.0 DESIGN FOR SOLDER ATTACHMENT RELIABILITY
     5.1 Primary Design Parameters
     5.2 Secondary Design Parameters
6.0 MANUFACTURE/PROCESSES
     6.1 Process Control and Verification
     6.2 Consequences of Defects
     6.3 Material Properties
7.0 ACCELERATED RELIABILITY TESTING
     7.1 Reliability Program/Strategy
     7.2 Generic Damage Mechanism Investigations
     7.3 Thermal Cycling
     7.4 Mechanical Cycling
     7.5 Vibration
     7.6 Creep Rupture Tests
     7.7 Mechanical Shock Testing
     7.8 Failure Criteria for Solder Joint Fatigue
          Tests
     7.9 Accelerated Life Test Planning
     7.10 Failure Mode Analysis
     7.11 Reporting Results
Appendix A Step-by-Step Example
Appendix B References
Appendix C Bibliography
Figures
Tables

Provides guidelines for accelerated reliability testing of surface mount solder attachments for evaluating and extrapolating the results of these accelerated reliability tests towards actual use environments of electronic assemblies.

DevelopmentNote
Included in IPC C 103 & IPC C 1000. (08/2008)
DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Current

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